SEMI pointed out that global semiconductor production capacity will achieve a breakthrough increase in 2024, due to multiple reasons such as the increase in cutting-edge logic and foundry capacity, applications such as generative artificial intelligence and high-performance computing (HPC), and the recovery of final chip demand.
"Reviving global market demand and strengthening government incentives are driving a surge in fab investment in major chip manufacturing regions, with global capacity expected to grow 6.4% in 2024," said Ajit Manocha, SEMI president and executive officer. "Global demand for semiconductor manufacturing A heightened focus on the strategic importance of national and economic security is a key catalyst for these trends."
The report shows that from 2022 to 2024, the global semiconductor industry plans to start operating 82 new fabs, including 11 projects in 2023 and 42 projects in 2024, with wafer sizes ranging from 300mm to 100mm ( 12 inches to 4 inches).
From a regional perspective, China leads the expansion of the semiconductor industry. China's share of global semiconductor production is expected to grow, driven by government funding and other incentives. Mainland China's semiconductor manufacturers' production capacity will increase by 12% year-on-year in 2023, reaching 7.6 million wafers per month. Mainland China chip manufacturers are expected to start operating 18 projects in 2024, with production capacity increasing by 13% year-on-year in 2024, reaching 8.6 million wafers per month.
Taiwan, China, will remain the second largest region in semiconductor production capacity. Production capacity will increase by 5.6% to 5.4 million wafers per month in 2023 and 4.2% to 5.7 million wafers per month in 2024. Five new semiconductor companies will be established in 2024. Round factory.
South Korea's chip production capacity ranks third with 4.9 million wafers per month in 2023, and will increase to 5.1 million wafers per month in 2024. Japan's production capacity is expected to reach 4.7 million wafers in 2024.
The Americas will have six new fabs by 2024, and chip production capacity will increase by 6% year-on-year to 3.1 million wafers per unit. Europe and the Middle East is expected to increase capacity by 3.6% in 2024, reaching 2.7 million wafers per month. With the launch of four new fab projects, Southeast Asia is expected to increase production capacity by 4% to 1.7 million wafers per 2024.
From the product field, due to weak demand for consumer electronics such as personal computers and smartphones, the storage chip field will slow down its production capacity expansion in 2023. The monthly production capacity will only increase by 2% in 2023, reaching 3.8 million wafers per month. In 2024, it will Increased by 5% to reach 4 million wafers per month. Installed capacity of 3D NAND is expected to remain flat at 3.6 million wafers per month in 2023 and increase 2% to 3.7 million wafers per month in 2024.
In the field of discrete components and analog chips, vehicle electrification remains a key driver of capacity expansion. Among them, the production capacity of discrete component chips is expected to increase by 10% in 2023, reaching 4.1 million wafers per month, and will continue to increase by 7% in 2024, reaching 4.4 million wafers per month. Analog chip production capacity is expected to increase by 11% in 2023 to 2.1 million wafers, and by 10% in 2024 to 2.4 million wafers.
Tags：