As the storage industry is deeply engulfed by the AI-driven boom, major storage manufacturers are unanimously shifting their strategic focus to AI-oriented storage solutions characterized by high bandwidth, large capacity, and low power consumption. With the continued surge in demand for high-bandwidth memory (HBM), some manufacturers have already fully booked their HBM capacity for 2026, a trend that will directly benefit HBM-related equipment suppliers.
Because HBM uses a multi-layer stacked DRAM architecture, the number of stacked layers increases with performance requirements. This characteristic leads to more complex inter-chip interconnect processes and significantly increases the number of processing steps required.
In addition to international equipment giants, Chinese equipment suppliers are also actively developing HBM equipment, with products covering multiple sub-segments such as etching, deposition, bonding, and inspection.
NAURA can provide a range of core equipment required for HBM chip manufacturing, including deep silicon etching, thin film deposition, thermal processing, wet cleaning, and electroplating equipment.
Maxwell stated that its highly selective etching tools and hybrid bonding equipment can be applied to DRAM (HBM) processes. The company's etching and thin-film deposition equipment is widely used in memory chip and logic chip manufacturing.
U-Precision provides chemical mechanical polishing (CMP) equipment, thinning equipment, dicing equipment, and edge polishing equipment, which are key core equipment for chip stacking and advanced packaging processes such as HBM and CoWoS (Wafer-on-WoS), and have been widely adopted by many leading customers.
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