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TSMC: 7nm process technology is at least one year ahead of its rivals

Sunday,Apr 21,2019

 According to Taiwan's "Economic Daily" report, on the 17th, TSMC's 2018 annual report was released. TSMC Chairman Liu Deyin and President Wei Zhejia jointly joined the company for the first time. In the report to the shareholders, TSMC's advanced process of 7 nanometers led the opponent for at least one year and emphasized 5G. And artificial intelligence (AI) will drive the semiconductor industry to continue to grow.

 
Liu Deyin and Wei Zhejia’s shareholder report in the annual report indicated that TSMC’s wafer shipments reached 10.8 million wafers last year, an increase of 2.9%, providing 261 different process technologies and producing 10,000 customers for 10,000 customers. 436 different products have climbed to 56% in the field of integrated circuit manufacturing services and have grown for nine years.
 
In terms of process technology, TSMC's second-generation 7-nanometer process technology is scheduled to be mass-produced this year and will become the industry's first commercial ultra-violet (EUV) lithography process technology. As for the development of 5nm process technology, the progress is in line with expectations, and the trial production is scheduled for this quarter. The customer product design finalization plan will start in the first half of this year and mass production in the first half of next year. TSMC's 3nm technology has also entered the stage of comprehensive development.
 
Liu Deyin and Wei Zhejia stressed that last year was a year in which TSMC reached many milestones. Revenue, net profit and earnings per share have been record for seven consecutive years; TSMC has successfully mass-produced 7-nanometer process, leading other peers for at least one year, and is the most advanced in the industry. The logic process technology, the second generation 7 nanometer enhanced version also entered the trial production.

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